Sensata | IC Burn-In Test Socket Engineering Support

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Technical Papers

Burn–In Test Sockets for Chip Scale Packages: Overcoming the Challenges of Fine Pitch BGA
Written in 1998 By James A. Forster, Kiyokazu Ikeya, Masao Tohyama, Sal P. Rizzo

Site Updated 17 Nov. 2008

Sensata > Support > Burn–in Test Socket Engineering

Engineering

Sensata Technologies isn’t just setting the standard for core and custom burn–in test solutions, we’re advancing next–generation package roadmap requirements—including emerging chip scale packaging design, manufacturing and assembly techniques.

Sensata’s worldwide design efforts are supported by the resources of our Advanced Analysis and Computational Development Laboratory. Our global engineering staff is ready to assist in determining and designing your burn–in test sockets and, should you need them, advanced communications apps are also available.

To learn more, please contact us »

Tailored Engineering

For testing products that demand a more tailored approach, TI offers a range of technical expertise and a full breadth of burn–in socket solutions led by our CSP test sockets.

Worldwide Support

24 hour global support enables us to serve you with rapid response. With engineering teams in key geographic locations including Japan, Korea, and North America, our team is never more than a few hours from your facility. Our distributed design and decision making capability allows our local application engineers and sales staff to meet with you in real time and make decisions today.

24/7 Worldwide Support

CSP Technology Leadership

Product Brochures

	0.5mm Pitch BGA CSP (PDF) 4/26/05 720KB 2 Pages
	Logic (PDF) 4/26/05 3.3MB 6 Pages
	Memory (PDF) 4/26/05 2.1MB 4 Pages

Our engineering and design capabilities include:

FEA and 3D Modelling

Using the latest 3D design tools such as SolidWorks and non–linear FEA analysis, our engineers create new designs in shorter periods of time.

Prototyping

The availability of on–site model shops and rapid prototyping facilities allows the creation of prototypes so that customers can evaluate new designs and concepts.

Thermal and Mechanical Testing

A comprehensive technical service laboratory with advanced thermal analysis capabilities and wind tunnels allows Sensata to evaluate a socket’s thermal characteristics.

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