Whether you’re looking for an off-the-shelf burn–in test socket or a custom CSP solution, Sensata Technologies offers unmatched capacity, worldwide bandwidth and manufacturing flexibility.
Product Brochures
Click below to download our brochures in PDF format. (From left to right: logic, memory, and 0.5mm pitch BGA CSP)
Latest Technology
Burn–in sockets that are available for the latest package technologies, including:
• BGA and CSP
• Pb and Pb–free solder
• POP
• SIP
• Stacked die
• Stacked packages
What Do We Do?
WE ARE YOUR PARTNER IN DEVELOPING THE SOLUTION.
Moore’s Law. The race is on. Semiconductor companies put more function into small form factors, back–end packaging and assembly teams develop new package formats, and suppliers develop sockets with higher I/O. The Interconnection team at Sensata Technologies eliminates the burn–in socket selection process. Our relationship with you is a partnership: As innovators and as people, we know that the best solutions come only when someone understands your needs. There’s no time to waste. Learn more...
